logo
Fornecedor de produção galvanizada de alta qualidade
Casa Produtosroda de moedura bond da resina

Resin Bond Diamond Grinding Wheel 4A2 150*14*20*5*2mm D64 C100 for Sharpening of carbide tools

Resin Bond Diamond Grinding Wheel 4A2 150*14*20*5*2mm D64 C100 for Sharpening of carbide tools

Detalhes do produto:
Lugar de origem: Henan, China
Marca: JC
Certificação: ISO
Número do modelo: 4A2
Condições de Pagamento e Envio:
Quantidade de ordem mínima: 5 peças
Preço: Negociável
Detalhes da embalagem: PCes 1 em uma caixa de papel
Tempo de entrega: 5-8 dias de trabalho
Termos de pagamento: T/T, D/A, D/P, Western Union, Paypal
Habilidade da fonte: 10,000/mês
Contato
Descrição de produto detalhada
Forma: Tipo de disco Uso: Moagem
Agente bond: Resina Entrega: Por expresso
Pacote: Caixa de caixa Código HS: 6804211000
Abrasivos: Diamante Aplicativo: Carboneto cimentado
Diâmetro: 150mm Grossura: 14mm
Buraco interno: 20mm Largura do abrasivo: 5mm
Granularidade: D64 Profundidade do abrasivo: 2mm
Material base: Alumínio
Destacar:

resin bond diamond grinding wheel for carbide tools

,

4A2 diamond grinding wheel D64 C100

,

150mm resin bond grinding wheel with warranty

4A2 Resin Bond Doamond Grinding Wheel Product Description


Product Name: Resin Bond Diamond Grinding Wheel


Product Overview:

 

Resin diamond grinding wheel is a high-performance grinding tool with resin as the binder and diamond abrasive as the cutting body. It combines the ultra-high hardness of diamond and the flexibility of resin binder, and is suitable for high-precision and high-efficiency processing of hard and brittle materials such as ceramics, glass, semiconductors, and cemented carbide.

 

Product Features:

 

High grinding efficiency: Diamond has an extremely high hardness (Mohs hardness 10), which can quickly remove hard and brittle materials.

Good self-sharpening: Resin binders wear moderately, which can continuously expose new abrasive grains and maintain sharpness.

Low grinding temperature: Resin has poor thermal conductivity, but thermal damage can be reduced through pores or coolant.

High surface quality: Suitable for precision machining, reducing chipping or cracks on the workpiece.

Lightweight design: Resin has low density and is suitable for high-speed grinding.

 

Product size(mm):

 

Diameter(D) Thickness(T) Inner hole(H) Abrasive width(W) Abrasive depth(X) Granularity
150 15 20 5 2 D64

 

Of course if you need other sizes , we can  customize for you.

 

Application:

 

Cemented carbide: sharpening and polishing of cutting tools and molds.

Ceramics/glass: precision processing of mobile phone covers and optical lenses.

Semiconductor materials: cutting and grinding of silicon wafers and silicon carbide wafers.

Stone processing: shaping and polishing of marble and granite.

 

Packaging and Shipping:

 

Each CBN grinding wheel is carefully packed in a sealed bag and wrapped with bubble film to prevent scratches or damage during transportation. After packaging, it is placed in a carton and sealed securely with tape. All orders are shipped via reliable couriers. After the order is shipped, we will provide customers with tracking information and estimated delivery time.

 

Competitive Advantages:

 

1.We offer high quality products at competitive price.
2. Shortest delivery time.
3. Flexible payment terms.
4. Timely after-sale service.
5. Most of our equipment can be replaceable with international brands.
6. Our products have been exported to Argentina, Egypt, US, Australia, Romania, Pakistan, Dubai, Abu Dhabi, Iran, India,
Indonesia, Vietnam, Malaysia and many other countries.

 

Resin Bond Diamond Grinding Wheel  4A2 150*14*20*5*2mm D64 C100 for Sharpening of carbide tools 0

 

 

Looking forward to your inquiry!

Contacto
ZHENGZHOU JINCHUAN ABRASIVES CO., LTD.

Pessoa de Contato: Dora

Telefone: +8617797761592

Envie sua pergunta diretamente para nós
Outros Produtos